{ "_meta": { "name": "Flyback Electronics", "description": "In-depth electronics insights, deep dives, analysis and emerging trends in semiconductors, AI, and robotics.", "url": "https://flybackelectronics.com", "feed_url": "https://flybackelectronics.com/ai.json", "rss_url": "https://flybackelectronics.com/feed.xml", "generated_at": "2026-04-13T07:56:26.096Z", "total_articles": 20, "contact": "hello@flybackelectronics.com" }, "articles": [ { "title": "AI Chip Market Growth: 2024–2028 Forecast", "url": "https://flybackelectronics.com/article/ai-chip-market-growth-20242028-forecast", "slug": "ai-chip-market-growth-20242028-forecast", "excerpt": "Analyzing the $120B trajectory of AI accelerator silicon and who stands to dominate.", "author": "Alex Chen", "category": "AI Hardware", "published_at": "2026-03-05T11:13:48.581", "read_time_minutes": 9 }, { "title": "RISC-V vs ARM: The Battle for Edge Dominance", "url": "https://flybackelectronics.com/article/risc-v-vs-arm-the-battle-for-edge-dominance", "slug": "risc-v-vs-arm-the-battle-for-edge-dominance", "excerpt": "How the open ISA is reshaping the microcontroller and embedded processor landscape.", "author": "Maya Patel", "category": "Edge Computing", "published_at": "2026-03-02T11:13:48.581", "read_time_minutes": 11 }, { "title": "Semiconductor Supply Chain Risk Report 2025", "url": "https://flybackelectronics.com/article/semiconductor-supply-chain-risk-report-2025", "slug": "semiconductor-supply-chain-risk-report-2025", "excerpt": "Mapping geopolitical dependencies and single-point failures in global chip manufacturing.", "author": "Jordan Lee", "category": "Semiconductors", "published_at": "2026-02-27T11:13:48.581", "read_time_minutes": 13 }, { "title": "The Silicon Brain: Neuromorphic Computing Explained", "url": "https://flybackelectronics.com/article/the-silicon-brain-neuromorphic-computing-explained", "slug": "the-silicon-brain-neuromorphic-computing-explained", "excerpt": "From neuromorphic chips to photonic computing — the frontier beyond von Neumann architecture.", "author": "Sam Torres", "category": "Neuromorphic", "published_at": "2026-02-24T11:13:48.581", "read_time_minutes": 10 }, { "title": "Graphene's Promise for Flexible Electronics", "url": "https://flybackelectronics.com/article/graphenes-promise-for-flexible-electronics", "slug": "graphenes-promise-for-flexible-electronics", "excerpt": "Moving beyond the hype: manufacturing challenges and the reality of flexible screens.", "author": "Alex Chen", "category": "Materials", "published_at": "2026-02-21T11:13:48.581", "read_time_minutes": 7 }, { "title": "Power Electronics Revolution: GaN and SiC Take Over", "url": "https://flybackelectronics.com/article/power-electronics-revolution-gan-and-sic-take-over", "slug": "power-electronics-revolution-gan-and-sic-take-over", "excerpt": "Wide-bandgap semiconductors are displacing silicon in EV chargers, solar inverters, and data centres.", "author": "Maya Patel", "category": "Power Electronics", "published_at": "2026-02-18T11:13:48.581", "read_time_minutes": 8 }, { "title": "The HBM3 Memory Wars: Samsung vs SK Hynix vs Micron", "url": "https://flybackelectronics.com/article/the-hbm3-memory-wars-samsung-vs-sk-hynix-vs-micron", "slug": "the-hbm3-memory-wars-samsung-vs-sk-hynix-vs-micron", "excerpt": "AI training clusters demand memory bandwidth that GDDR6 cannot provide. 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